WSS and ZoneBOND Temporary Bonding Techniques Comparison for 80μm and 55μm Functional Interposer Creation
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)（2013）
Key words
elemental semiconductors,integrated circuit interconnections,silicon,three-dimensional integrated circuits,wafer bonding,3D devices,WSS,ZoneBOND,backside process,functional interposer creation,interposer flatness control,size 300 mm,size 50 mum,size 55 mum,size 80 mum,temporary bonding integration,thin wafer handling,three-dimensional stacked integrated circuits,wafer support system
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