Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys
Journal of Electronic Materials（2022）
关键词
Lead-free solder,microstructure,intermetallic compound (IMC),mechanical properties
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要