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Cryogenic Flip-Chip Interconnection for Silicon Qubit Devices

Tokio Futaya,Raisei Mizokuchi, Misato Taguchi,Takuji Miki,Makoto Nagata,Jun Yoneda,Tetsuo Kodera

JAPANESE JOURNAL OF APPLIED PHYSICS（2024）

Cited 0|Views13
Key words
quantum dot,interposer,flip-chip packaging,silicon spin qubit,laser cut,RF reflectometry
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