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Improved Strength-Ductility Synergy in a Novel CrCoNiFe/Cu Composite Via Metallurgical Bonding Interfaces

Chuang,Baisong Guo,Xiang Yu, Shengfen Zhou,Xiaojian Wang, Shuo Yin,Wei Li, Zhiguo Zhang

JOURNAL OF ALLOYS AND COMPOUNDS(2025)

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Key words
High-entropy alloys,Cu matrix composites,Mechanical property,Electrical conductivity,Strengthening mechanism
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